LeEco has announced the sale of their flagship LeEco Le Max Pro starting 22 February, at MWC 2016. The device is ridiculously powerful, playing host to the Snapdragon 820 and with specs to match. The phone will be priced at 1,999RMB (Rs 21,000).


The Le Max Pro made waves at CES 2016, walking away with the “Best of CES” award and is a device that boasts of a number of world firsts. The device is the first device to offer the Snapdragon 820 chipset, an ultrasonic finger print scanner and support for 802.11ad. It’s also claimed to be the world’s first device to use a full-floating glass panel.

If that wasn’t enough, the device will have 4GB of RAM and use UFS 2.0 flash storage for the internal memory. To those not in the know, UFS 2.0 is the gold standard as far as speed in the mobile space is concerned.

The imaging sensor is also no slouch. The rear camera is the lovely 21MP Sony IMX 230 sensor coupled to an f/2,0 lens, while the front camera is a 4MP one with a wide-angle lens.

The device is a gorgeous blend of aluminium and glass, featuring a bezel-less design, a unibody, all-metal, aluminium design. It’s also a screwless design and uses the aforementioned floating glass panel, which was apparently custom made by Sharp.

LeEco seems to have timed the release date of the device just before Xiaomi’s press event tomorrow, where they’re expected to announce their own Snapdragon 820 powered, WiFi 802.11ad and 26MP camera toting Mi 5. The Mi 5 is also expected to be priced in the same range as the LeEco Le Max Pro.

source link : tech.firstpost.com